Our thermally conductive potting products range from room temperature cure to high temperature, with variable viscosity to suit your application. Formulated with various conductive fillers, our products are designed to offer maximum thermal conductivity while still being process friendly. Used highly in the electronics, aerospace, medical, and automotive industries, these thermally conductive potting compounds will deliver on consistent high performance.

Our one and two component thermally conductive epoxy adhesives are used extensively in aerospace, electronic, semiconductor and medical industries. Important properties of these adhesives include excellent electrical insulation, chemical resistance, Halogen Free, vibration and impact resistance, and high bond strength to a variety of substrates. Thermally conductive formulations are used for bonding, potting and encapsulation applications in a wide variety of industries. Some specific applications include heat sink bonding, potting/encapsulating sensors, BGA die attach, semiconductors, chip packaging.

The STG series are silicone-based thermal greases engineered with special binding agents to reduce bleed and oil separation. Our silicone greases have a flowable matrix filling micro gaps and reduces contact resistance. Our greases have cost advantages over other products such as pads, and pre-forms, while performing and withstanding heat better than organic greases.

The TG series of metal-oxide-filled, silicone-free synthetic grease is specially formulated to enhance heat transfer across the interface between the semiconductor case and the heatsink. Our line of non-silicone greases do not exhibit migration or contamination. With almost no-bleed, TG thermal greases are high-performance compounds that will not dry out, harden, melt, or run, even after long-term continuous exposure to temperatures up to 250°C.

We offer a wide variety of general use epoxy, urethane, and silicone potting compounds that can be used for several different applications spanning several different industries.

Urethane potting and encapsulating systems offer advantages when curing at lower temperatures. Mechanically, urethanes offer better flexibility and crack resistance, as well as better adhesion to certain substrates, like plastics and composites. It is ideal for electronic applications, surface mount technology, and when thermal cycling resistance is a requirement. Our urethane potting materials have low CTE rates ensuring flexibility at even extremely low temperatures.

Silicone potting and encapsulating compounds are formulated for the demanding high-performance requirements of the electrical and electronic industries for such applications as the potting of electronic ballasts, capacitors, power supplies, relays and other devices with high heat dissipation requirements. Many of our silicone potting compounds are UL approved for flame retardant properties and can withstand temperatures of over 200°C.

Light Cure Adhesives (UV and Visible Light Cure Adhesives) cure quickly when exposed to light of the appropriate wavelength and intensity. They are one component adhesives which are solvent free (100% solids) and are ideal for many applications in used in the assembly of electronics, medical devices, and visual graphics. Unique products include delay cured epoxy adhesives which allow and open time after exposure for bonding opaque substrates as well as UV/Heat dual cure systems which can cure via light exposure or heat (or both) allowing for use in shadow areas.

Medical grade epoxy is used in medical device assembly and other applications. Medical devices that use medical epoxies include MRI machines, cardiac catheters, medical probes, and ultrasounds. Adhesives are universally used for bonding cannulae to hubs in needle assemblies. It is critical that this joint is well sealed to prevent fluids, such as blood or medicine, from leaking. For these applications, one-part heat cure epoxy adhesives are the lowest cost options with the best chemical resistance. Other types of adhesives include light cure acrylates and cyanoacrylates. Many of our medical epoxy systems are USP Class VI certified for biocompatibility.

Optical adhesives are used for bonding and coatings in various fiber optic applications. These adhesive types are frequently used to bundle optical fibers and bond components in optoelectronic devices used for telecommunication networks, aircraft, and satellites, medical and scientific instruments. Our products are specifically designed for non-yellowing and UV light resistance.

We supply products designed specifically for use electronic assembly, such as materials for use in dam & fill, glob top, die attach, underfills etc. Our products are tested and proven to work for numerous applications and range in properties such as viscosity, conductivity, and cure times to fulfill a wide range of specifications.

High-temperature adhesives are designed for applications in electronics/microelectronics, medical, aerospace, automotive and other industries. They cure fast at moderately elevated temperatures. The cured systems provide an excellent bond to metals such as ferrite and beryllium and retain the bond strength even at higher temperatures.The fully cured products have excellent dielectric properties, and very good thermal shock & impact resistance. They also have good resistance to weather, water, most petroleum products, mild acids & alkalis, and many other chemicals.